Atomic Layer Deposition Diaphragm Valves, ALD Series






描述
Our advanced ALD valve technology delivers an ultra-high cycle life and enhances chip production efficiency.
>
>
>
>
Atomic Layer Deposition Diaphragm Valves, ALD Series
Atomic Layer Deposition (ALD) is a technique that deposits materials in the form of one atomic layer at a time on the substrate surface. XINVAL ALD Series Atomic Layer Deposition Diaphragm Valves are ideal for the ALD process, delivering precise doses of gas during semiconductor chip manufacturing. These valves ensure the uniform gas deposition required for advanced technology
Features
Ultra-high cycle life under high-speed operation
Fast response time, capable of opening or closing the valve in less than 15ms
Valve flow consistency within ±3%
Heat-resistant design extends actuator life in high-temperature applications
Fully enclosed seat design offers superior resistance to expansion and contamination
Cobalt-nickel alloy diaphragm enhances strength and corrosion resistance, providing a long service life
High-purity grade PFA seat provides broad chemical compatibility
Suitable for ultra-high purity applications
Modular surface mounting, compression fitting welding, and metal face sealing termination options are available
Related Resources
Message
We will help you find the right solution